Nasdaq

Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications

MOUNTAIN VIEW, Calif., Oct. 22, 2020 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5 ...
Semiconductor Engineering

Advanced Design Planning In IC Compiler II

Design exploration and planning is becoming an increasingly critical step of the design creation process as growing constraints and requirements are placed upon it. IC Compiler II has been architected ...
Design-Reuse

IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks

MOUNTAIN VIEW, Calif., May 28, 2019 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its innovative IC Compiler ™ II place-and-route solution with Advanced Fusion technologies has been deployed ...
Semiconductor Engineering

Accelerating Toshiba’s Advanced System-on-Chip (SoC) Design with Synopsys’ Fusion Compiler

How Toshiba used early access to an RTL-to-GDSII solution to shorten design time of an advanced, automotive SoC. Authors: Mitchy M. Mitsuyasu, Senior Specialist, Semiconductor R&D, Toshiba Electronic ...
Design-Reuse

Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications

MOUNTAIN VIEW, Calif., Oct. 22, 2020-- Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC ...