SAN MATEO, Calif.--(BUSINESS WIRE)--OpenFive, a leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the successful tape out of a high-performance SoC on ...

KANSAS CITY, Mo., May 11, 2023 — Advanced Clustering Technologies has announced the release of ClusterVisor 1.0, an update the company said enhances the features and benefits of this high performance ...

BEIJING & SUNNYVALE, Calif.--(BUSINESS WIRE)--Promoter of high performance computing (HPC) and artificial intelligence (AI) education and expertise, the HPC-AI Advisory Council (HPCAIAC) today ...

Supermicro Showcases at the World's Largest Gathering of Supercomputing Experts the Latest Innovative Breakthroughs in HPC Systems Including BigTwin™, FatTwin, SuperBlade®, and AI/Machine Learning SAN ...

We recently compiled a list of the 10 AI News Investors Should Not Miss. In this article, we are going to take a look at where Advanced Micro Devices, Inc. (NASDAQ:AMD) stands against the other AI ...

In quarterly earnings reports this year, the CEO and founder of NVIDIA (a Liqid partner) noted that its recent advancements in delivering its new compute platform designed with AI in mind and its ...

ALISO VIEJO, Calif., June 21, 2011 (GLOBE NEWSWIRE) -- QLogic Corp. (Nasdaq:QLGC) today announced that its TrueScale InfiniBand solutions have been deployed in a new HPC cluster at McGill University ...

ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022. Some subscribers prefer to save ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More The world’s fastest supercomputers are getting faster with both Nvidia ...

Supermicro Brings the Latest Innovative Breakthroughs in HPC Solutions Including Petascale All-Flash NVMe, BigTwin™, SuperBlade®, and AI Deep Learning Systems Optimized with NVIDIA GPUs to the World's ...

Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat dissipation ...