Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

The International Test Conference is the electronic industry’s premier event dedicated to the testing of devices, boards, and systems, from design verification to final testing. At this year’s version ...

At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation ...

The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special ...

More than 47,000 attendees filled Chicago's McCormick Place for Pack Expo International from Nov. 3-6, 2024. Event producer PMMI, The Association for Packaging and Processing Technologies, said this ...

The company received additional orders in 3Di metrology, including from an OEM for panel level process development, and sees growth in panel-level packaging as a trend for enterprise server and AI ...

TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, said ‌on Thursday that it expects its advanced packaging business ‌to double in size to $3.2 ...

ALBANY, N.Y. — Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for advanced ...