WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...
Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
Advanced chip packaging offers India a chance to join the global semiconductor chain. Prabhu Raja of Applied Materials said the country’s talent can help achieve its semiconductor goals if innovation ...
Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...
AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ -- Electroninks, the leader in metal complex inks for ...
SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...
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