Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

Quick Read Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Nvidia Corp’s (NASDAQ:NVDA) demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (NYSE:TSM) remains robust despite its evolving technology requirements, Reuters cites Nvidia chief ...