For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

As many of you may have seen, we’ve passed a major milestone since Siemens announced its intent to acquire Mentor Graphics four years ago. As of January 1, 2021, “Mentor, a Siemens business” has ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...

One cannot imagine the world now and in the future without integrated circuits (IC or generally known as chips). With worldwide revenue projected to be about $500 billion by the end of 2019, the chip ...

Taiwan is an important hub of the global information and communication technology (ICT) industry. The development of the ICT supply chain is supported by Taiwan's complete semiconductor ecosystem.

Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...

For engineers and startups in Malaysia, bringing a chip from concept to reality has long meant relying on overseas facilities. IC Design Park 2 in Cyberjaya is rewriting that story, offering a ...