Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

A walk-through of Apple partners' chip fabrication lines practically demonstrates how the company's push to expand ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TSMC's vast complex outside Phoenix is central to that effort. The 2,000-acre site is slated to host six fabrication plants along with supporting infrastructure. Apple is ...

TL;DR: Apple and Bitmain will lead demand for TSMC's cutting-edge 2nm process node in 2026, with TSMC ramping capacity to 60,000 wafers monthly by Q4. NVIDIA will adopt TSMC's 3nm node for Rubin AI ...

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

As part of new environmental efforts announced on Tuesday, Apple said it will cut down on the material used in iPhone 13's packaging by removing the outer plastic wrap that typically enshrines the ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to ...