The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

MAINBOARD-LISTED Nico Steel Holdings on Monday said it has received approval for its patent on the electroplating process of an aluminium alloy with copper, for a period of 20 years, starting from ...

Electroplating intermediates refer to a class of fine chemicals used as electroplating additives. Unlike the salt used in the plating production process, the electroplating intermediate is an additive ...

Fraunhofer ISE development also uses recyclable aluminum for masking – removing need for problem polymers. Thin copper contacts mean the silicon layer does not experience much shading. The rising ...