Researchers have designed a robust image-based anomaly detection (AD) framework with illumination enhancement and noise suppression features that can enhance the detection of subtle defects in ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

What if manufacturing companies could pinpoint the exact cause of a defect the moment it occurs, preventing costly production delays and ensuring top-notch quality? Generative artificial intelligence ...

The AI model rapidly maps boundary conditions to molecular alignment and defect locations, replacing hours of simulation and enabling fast exploration and inverse design of advanced optical materials.

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...