Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Defect-engineered zinc oxide converts tiny reversible strains into near-infrared light, opening a rare-earth-free path to ...

Creating a system to localize failure mechanisms causing abnormal electrical behavior, including those linked to complex parameters (such as frequencies, amplitudes, and digital values contained in ...

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.

October 26, 2012. Aegis Software announced that Sechan Electronics Inc., a contract manufacturing services company, chose Aegis’ Quality System as a replacement for Sechan's paper-based defect mapping ...