Semiconductor Engineering

Catching Critical Defects In TSVs And Stacked Chips

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
AZOM

Enhancing Chemical Mechanical Planarization (CMP) Yield Through Multivariable Process Monitoring

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Semiconductor Engineering

Hunting For Macro Defects

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
AZOM

CMP Process: Online Monitoring of Hydrogen Peroxide

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
Electronic Design

Make the Move to Machine Learning, Neural Networks for CMP Modeling

Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...