With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...

Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

Hamilton's in-line cell density sensors have found application in various customer scenarios, spanning from feed control to continuous processing. This eBook offers a concise compilation of pertinent ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

Schaumburg, Ill. — Omron Electronic Components LLC has introduced the G5T series of slim power PCB relays in a 7.0 x 20.4 x 15.0-mm (WxLxH) footprint, making them suitable for high-density ...

Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...

Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...

TINLEY PARK, Ill.--(BUSINESS WIRE)--Panduit Corp., the leading global provider of small diameter 28-AWG cabling solutions, has added UTP and Shielded Category 6A performance patch cords to its 28-AWG ...