The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

Marks the world’s first implementation in a large-scale semiconductor manufacturing plant, with full-scale introduction in the EDS process planned for April 2024 Santa Clara, CA and Kyoto, Japan, Dec.

Rohm Semiconductor and Quanmatic have been collaborating since January 2023 to introduce quantum technology into the EDS (electrical die sorting) process, conducting demonstrations to optimize ...