Although the industry finds itself grappling with a very broad and varied technology space, it is not a surprise we find ourselves at this inflection point. John von Neumann himself anticipated that ...

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, ...

Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound semiconductors. Save ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

Forbes contributors publish independent expert analyses and insights. Samsung had an industry Foundry event focused on solutions for “Empowering the AI Revolution,” where they announced new process ...

Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, and Scintil Photonics, the technology leader in Heterogeneous Integrated Photonics for ...