Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
June 24, 2024 -- Plano, Texas, USA -- Siemens Digital Industries Software today introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast ...
PARIS--(BUSINESS WIRE)--ESI Group (Paris:ESI), leading innovator in Virtual Prototyping software and services for manufacturing industries, announces the latest release of IC.IDO, its Virtual Reality ...
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