As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

Keeping abreast of the latest regulations, industry guidance, and best practices not only strengthens your understanding of PAT/EET testing but also helps you approach each inspection more efficiently ...

While many articles have been written about cell testing in R&D labs or cell testing during manufacturing in the factory, let’s turn to the topic of cell testing for incoming inspection. This article ...