The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting ...

New legislation, consumer pressure and product differentiation are all reasons to rethink packaging with sustainability in mind. But it still needs to be fit for purpose. David Wright, RSSL’s ...

The semiconductor industry is undergoing rapid transformation, driven by continuous technological advances, regulatory changes, and shifting end-user demands. This report offers senior decision-makers ...

Figure 1. (click to enlarge) Effect of temperature on seal strength. The green bars represent samples created using low temperature. The orange indicates packages created using the high-temperature ...

Different materials are used to make packaging in various shapes depending on the products it is intended to protect. Some forms of packaging include sealed bags to maintain the freshness of food, ...

The market for semiconductor packaging and test services should gradually recover as outsourcing by OEMs and chipmakers picks up, but analysts also warn of consolidation due to financial pressures and ...

Every year, millions of products arrive at their destination compromised by transit damage, despite being packaged with ...

Ottawa, Jan. 05, 2026 (GLOBE NEWSWIRE) -- The global diagnostic test kits packaging market attained a notable valuation in 2025 and is projected to grow substantially by 2034, as highlighted in a ...

FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant.