Prime Minister Narendra Modi will participate in the groundbreaking ceremony of the HCL-Foxconn Joint Venture project -- ...
Prime Minister Narendra Modi will participate in the groundbreaking ceremony of the HCL-Foxconn Joint Venture project - India Chip Pvt. Ltd. - at the Yamuna Expressway Industrial Development Authority ...
PM Modi performed the groundbreaking for the HCL-Foxconn joint venture chip project in Uttar Pradesh. He highlighted India's ...
PM Narendra Modi participated in the groundbreaking of the HCL-Foxconn Semiconductor Unit in Uttar Pradesh. He highlighted it as a historic milestone in India's journey toward becoming a global ...
The project reflects the Prime Minister’s vision of positioning the country as a trusted global hub for advanced electronics and semiconductor manufacturing.
PM Modi hailed India's tech growth, stating 'Made in India' semiconductor chips will boost global leadership. At the ...
Expected to be operational by 2028, the advanced facility will manufacture display driver integrated circuits (DDICs).
Operating under the Modified ATMP scheme, the YEIDA facility boasts a 20,000-wafer-per-month capacity, curbing India's chip import dependency while bolstering supply chains for mobiles, laptops, autos ...
Hailing India’s rapid strides in the technology sector, Prime Minister Narendra Modi on Saturday said, “This decade is ...