Process control is moving forward as quickly as data collection and processing can carry it, and a recent research effort demonstrated how fast and flexible, and adaptive, machining operations can be.

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What ...

The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...

Marcus Hoversland, a UW graduate and process engineer at HF Sinclair in Casper, interacts with UW students in an “Intro to Chemical Engineering” class. UW has received a generous investment from HF ...