Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Process control and simulation lie at the heart of modern industrial operations, enabling continuous monitoring, dynamic adjustment, and predictive optimisation of complex process systems.
Advanced process control (APC) has incorporated and will continue to incorporate new technologies and methodologies that allow refiners and petrochemical plant operators to achieve and sustain ...
A new technical paper titled “Non-Traditional Design of Dynamic Logics using FDSOI for Ultra-Efficient Computing” was published by researchers at University of Stuttgart, UC Berkeley, Indian Institute ...
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