The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied primarily on manual component insertion and wave soldering has transformed ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake! There are a variety of methods for reflowing a ...

As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...