(RTTNews) - STMicroelectronics N.V. (STM), a semiconductor leader serving customers across the spectrum of electronics applications, on Wednesday announced said it will develop the next generations of ...

Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on ...

STMicroelectronics (NYSE:STM) will invest $60M in its plant in Tours, France amid a push to boost advanced semiconductor manufacturing, known as panel-level packaging. Shares of STMicro fell 0.5% in ...

STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with plans to commence ...

(MENAFN- EIN Presswire) EINPresswire/ -- The panel level packaging market is gaining increasing attention within the advanced semiconductor packaging ecosystem as manufacturers seek scalable, cost ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...