Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Taiwan Semiconductor Mfg. Co. Ltd. (NYSE:TSM) is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims to ...

TL;DR: TSMC's Arizona facility manufactures next-gen chips but relies on Taiwan for advanced packaging due to lack of local services. This process supports AI server demand but increases shipping ...

One of the caveats of TSMC's manufacturing in the U.S. is that all wafers processed at Fab 21 in Arizona are shipped back to Taiwan for dicing, testing, and packaging, which is why processors fabbed ...

The semiconductor industry is facing a new logistical challenge driven by the unstoppable rise of artificial intelligence, which has already caused prices for key components to soar. According to ...

TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona.

The company began 2nm volume production in late 2025, running concurrently at Fab 20 - located beside TSMC’s global R&D centre - and the newly completed Fab 22 in Kaohsiung. Fab 20 has now entered ...

Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026. TSMC's faces costs, politics, and capacity obstacles Once framed as politically motivated, TSMC's US expansion has ...

AI demand is accelerating, and TSMC's slowdown is a big-numbers illusion. Advanced packaging, not silicon, is the industry's true bottleneck. TSMC, Powertech, and Advanced Semiconductor Engineering ...

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as ...

TEMPE, Ariz. & HSINCHU, Taiwan--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding ...