TL;DR: TSMC's advanced 3nm and 5nm process nodes are fully booked through 2026, driven by strong demand from AI, cloud, and HPC applications. Major tech firms like Apple, Qualcomm, NVIDIA, and AMD ...
TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving a data rate of ...
Synopsys has achieved first-pass silicon success using TSMC’s N2 process and certified digital and analog EDA (electronic design automation) flows for TSMC’s A16 and N2P technologies. The company said ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process ...
TSMC’s 3nm and 5nm chip capacity is expected to be fully booked through 2026 as Apple, NVIDIA, Qualcomm, and AMD secure orders for next-gen processors. Rising AI demand and limited supply may lead to ...
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