The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

Not all devices get tested the same way anymore, and that’s a good thing. Quality, test costs, and yield have motivated product engineers to adopt test processes that fall under the umbrella of ...

Are you grappling with managing your test data in an automation framework? Here’s a fact: effective Test Data Management (TDM) can significantly improve your software testing process. This ...

How the combination of AI and flexible, software-defined instrumentation is poised to revolutionize the test and measurement industry. How AI tools can significantly enhance the efficiency of data ...

RPA vs. test automation: What are the differences? Your email has been sent Automation tools have since adopted 4.0 technologies in their evolution. Part of this adoption uses RPA, artificial ...

A prototype MCU test chip with a 10.8 Mbit magnetoresistive random-access memory (MRAM) memory cell array—fabricated on a 22-nm embedded MRAM process—claims to accomplish a random read access ...

The two most common categories of process responses in industrial manufacturing processes are self-regulating and integrating. A self-regulating process response to a step input change is ...

When asked, many engineers will say that the goal of a test plan for a PCB is full or 100% test coverage. When pressed further, they usually admit that 100% test coverage is virtually impossible to ...