The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...

Korea University researchers have developed a machine-learning framework that predicts solar cell efficiency from wafer quality, enabling early wafer screening and optimized production paths. Using ...

It's a sign of the times when top semiconductor makers pool their resources to cover the rising cost of process technology development and fab construction. Providing the strongest evidence of this to ...

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Scientists from Germany’s Fraunhofer ISE – together with a consortium of plant manufacturers, metrology companies, and research institutions – have developed a new production line concept for ...

TOKYO — In a major boost for silicon-on-insulator technology, Toshiba Corp. will adopt Canon Inc.'s Eltran SOI wafer process for broadband microprocessors built in 0.1-micron and 0.07-micron process ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have ...