This file type includes high resolution graphics and schematics when applicable. Let’s face it: Some lucky folks don’t have to worry too much about power conversion. Just plug the board into the ...
The future of solar module design will be heavier, not lighter. With hail and extreme weather events increasing, module manufacturers are expected to shift toward thicker glass to improve impact ...
Ultra-Thin Copernicus GPS Module with Low Power Ideal for Drop-In, Ready to Go Positioning SUNNYVALE, CA—Trimble introduced the Copernicus GPS receiver, a thumbnail-sized, surface-mount, low power ...
Nisshinbo Micro Devices Inc. utilized the Virtuoso Studio custom IC design platform to boost layout productivity and gain a 30% reduction in turnaround time for routing analog blocks Seamless ...
TORONTO, Sept. 12, 2023 (GLOBE NEWSWIRE) -- POET Technologies Inc. (POET), the designer and developer of the POET Optical Interposer™ and Photonic Integrated Circuits (PICs) for the data center, ...
Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...
To add wireless connectivity to designs, product manufacturers need to get up to speed on wireless technologies as efficiently and inexpensively as possible. The most common way to add wireless ...
A new report published by the International Energy Agency offers a series of guidelines for the design of recyclable PV modules. The report aims to help manufacturers find the balance between ...
MUNICH--(BUSINESS WIRE)--PRO DESIGN, leading supplier of FPGA based prototyping systems, today launched its new proFPGA XCVU37P FPGA module for its flexible proFPGA product family. This new FPGA ...
Brand new today, we’re going to go all in with the Robotics Module Challenge! This is the newest part of the 2018 Hackaday Prize which is only six weeks old, and already we’ve seen almost six hundred ...
Infineon’s MIPAQ Pro intelligent power module integrates IGBTs, gate drivers, heat sink, sensors, digital control electronics, and digital bus communication into a single device to allow compact and ...