Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...
Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...
A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has ...
SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...
Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
WEST LAFAYETTE, Ind. – Purdue University researchers have developed a large-scale manufacturing process that may change the way some grocery store foods are packaged. According to Credence Research, ...
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