One of the pitfalls of modern engineering is that it’s entirely possible to end up in a situation where a product or solution ...
Abstract: To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate to meet ...
Abstract: This paper proposed a self-contained IoT sensor module which includes sensor for collecting various information, micro-computer and multiple solar panels for realizing dynamic cost reduction ...
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