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SIP - セミ コンダクター
製造 ライン - ITEC Die
Attach 1 - Gaas Wafer
Dicing - Desolder Chip
Hot Air - Gold From
DLP Chip - SIP SMT and Chip
On Board - Semi Con
Talk - Winndow Attach Process
in Packaging - How Die Is Made
From Wafer - Gold Bonding in Microchip
Design E - Silicon Die
Packaging - Semiconductor Assembly
Process - MCM
Package - Atmc
Wafer - Component Carrier
vs Subcarrier - Gold Solder
Chips - Desoldering
Low End PC - Desoldering with
a Heat Gun - Semiconductor Packaging
Process - MC Fluid
Encapsulation - IC
Packaging Videos - Gold-Capped IC
Gold Recovery - Ceramic Substrate Manufacturing
Process - Insulated Metal Substrate
in PCB - Chip Packaging
Process - Chip
Mold - Gold-Capped
IC Chips - IC
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