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ieee.org
Thermal and Failure Analysis of Advanced Microelectronic Devices
(37:36) - Andrew Tay, National University of Singapore Summary: Detecting sub-micron time-dependent thermal defects and identifying those that represent potential device failures is a challenge in the thermal analysis of today’s complex electronic devices. The scaling of device features results in a significant reduction in time response and ...
104 views
Nov 10, 2022
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